wafer Size：

2 inch~6 inch

Chip Size：

4x4~ 60x60 mil

Wafer thickness：

90~ 150μm

cutting way：

Min. 25μm

Equipment Functions：

♦ Auto wafer cassette input (One cassette 25pcs wafer)
♦ Broken wafer auto breaking function.
♦ Auto CCD system adjuest wafer orientation accuracy ±10μm
♦ CCD system auto adjuest cutting way
♦ Machine accuracy X axis 5μm, Y axis 2.5μm, Z axis 2μm
♦ Auto setting for re-breaking function for when wafer is not break