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GaAs wafer (砷化鎵)
半導體吸附裝置及基板>LED基板

江西德義半導體科技有限公司 (JianXi DeYi semiconductor technology Co., Ltd.)提供適用於LED產業應用的2」~4」 GaAs wafer (砷化鎵晶圓),已成功導入國內外知名LED磊晶廠,另與北京交通大學共建半導體材料先進製程工程技術研究中心(國家級),提供具有競爭優勢的GaAs wafer。

2」2 GaAs wafer規格:

Parameter

Specification

UOM

Conduct Type

S-C-N

 

Dopant

GaAs-Si

 

Orientation

(100)2°Off TowardA±0.5°

 

Orientation Angle

 

OF Orientation

EJ(0-1-1)±0.5°

 

OF Length

17±1

mm

IF Orientation

EJ (0-11)±0.5°

 

IF Length

7±1

mm

Diameter

50.8±0.3

mm

CC

0.4E18~2.5E18

/c.c.

Resistivity

N/A

ohm.cm

Mobility

N/A

cm2/v.s

EPD

 

/cm2

Thickness

350±20

um

TTV

<10

um

TIR

N/A

um

Bow

<10

um

Warp

N/A

um

Laser Marking

N/A

 

Surface

Side1:Polished   Side2:Etched

 

ParticleCount

N/A

 

Packaging

Cassette

 

4」15゚ GaAs wafer規格(1):

Parameter

Specification

UOM

Orientation

(100)15° Off TowardA±0.5°

 

Orientation Angle

180°

 

OF Orientation

EJ[0-1-1]±0.5°

 

OF Length

32±1

mm

IF Orientation

EJ [0-11]±0.5°

 

IF Length

18±1

mm

Diameter

100±0.2

mm

CC

0.5E+18~3.0E+18

E18/cm3

Resistivity

N/A

ohm cm

Mobility

≥1000

cm2/v.s

EPD

≤3000

/cm2

Thickness

350±25

um

TTV

≤10

um

4」15゚ GaAs wafer規格(2):

Parameter

Specification

UOM

Conduct Type

S-C-N

 

Dopant

GaAs-Si

 

Orientation

(100)15° Off TowardA±0.5°

 

Orientation Angle

180°

 

OF Orientation

EJ(0-1-1)±0.5°

 

OF Length

32±1

mm

IF Orientation

EJ (0-11)±0.5°

 

IF Length

18±1

mm

Diameter

100±0.2

mm

CC

0.4E18~4.0E18

/c.c.

Resistivity

N/A

ohm.cm

Mobility

≥1000

cm2/v.s

EPD

≤5000

/cm2

Thickness

350±20

um

TTV

<10

um

TIR

N/A

um

Bow

N/A

um

Warp

N/A

um

Laser Marking

NONE

 

Surface

Side1:Polished   Side2:Etched

 

Particle Count

NONE

 

Packaging

Single wafer packaging

 

4」6゚ GaAs wafer規格:

Parameter

Specification

UOM

Conduct Type

S-C-N

 

Dopant

GaAs-Si

 

Orientation

(100)6°±0.5°off towardA

 

Orientation Angle

1 8 0°

 

OF Orientation

EJ(0-1-1)±0.5°

 

OF Length

32±1

mm

IF Orientation

EJ(0-11)±0.5°

 

IF Length

18±1

mm

Diameter

100±0.2

mm

CC

0.5E18~3.0E18

/c.c.

Resistivity

N/A

ohm.cm

Mobility

≥1000

cm2/v.s

EPD

≤3000

/cm2

Thickness

350±20

um

TTV

<10

um

TIR

N/A

um

Bow

N/A

um

Warp

N/A

um

Laser Marking

NONE

 

Surface

Side1:Polished   Side2:Etched

 

ParticleCount

NONE

 

Packaging

Single wafer packaging

 

Hits6437 06/21,18
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